How you compute,  store data and  
 package is Your Choice - we'll help you
 make the right connections.

    Introducing HiperSem InterLink^TM: 
 The active semiconductor chip-to-chip
 communications and energy management
 product for 2.5D and 3D IC packaging
 solutions.

   To be available for 5V, 3.3V,  and 2.5V
 applications, with custom options.