How you compute,  store data and  
 package is Your Choice - we'll help you
 make the right connections.

    Introducing HiperSem InterLinkTM
 The active semiconductor chip-to-chip
 communications and energy management
 product for 2.5D and 3D IC packaging
 solutions
.

   To be available for 5V, 3.3V,  and 2.5V
 applications, with custom options.
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